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SCG002
Product Features
* DC - 6 GHz * +15.5 dBm P1dB at 1 GHz * +29 dBm OIP3 at 1 GHz * 21 dB Gain at 1 GHz * 3.8 dB Noise Figure * Available in Lead-free / green SOT-89 Package Style * Internally matched to 50
The Communications Edge TM Product Information
InGaP HBT Gain Block
Product Description
The SCG002 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the SCG002 typically provides 21 dB of gain, +29 dBm Output IP3, and +15.5 dBm P1dB. The SCG002 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is housed in a leadfree/green/RoHS-compliant SOT-89 SMT package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the SCG002 will work for other various applications within the DC to 6 GHz frequency range such as CATV and mobile wireless.
Functional Diagram
GND 4
1 RF IN
2 GND
3 RF OUT
Applications
* * * * * Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro
Function Input Output/Bias Ground
Pin No. 1 3 2, 4
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current
Typical Performance (1)
Units
MHz MHz dB dBm dBm MHz dB dB dB dBm dBm dB V mA
Min
DC
Typ
1000 21 +15.5 +29 2000 20 14 20 +15 +29 3.8 3.9 45
Max
6000
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 21.6 -17 -18 +15.8 +28 3.8
Typical
900 21 -17 -18 +15.5 +29 3.7 1900 20.5 -15 -21 +15 +29 3.8 2140 19.7 -14.5 -21 +14.9 +29 3.8
19
3.5
4.3
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +5 V, Rbias = 24 , 50 system. 2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature -40 to +85 C -55 to +150 C 150 mA +12 dBm +250 C
Rating
Ordering Information
Part No.
SCG002B-G SCG002B-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
700 -2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 1 of 4 April 2006
SCG002
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
The Communications Edge TM Product Information
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 24 , Icc = 45 mA
MHz dB dB dB dBm dBm dB 100 22 -18 -16.7 +15.4 +28 3.9 500 21.6 -17 -17 +15.6 +28 3.8 900 21 -16 -18 +15.5 +29 3.8 1900 20.5 -15 -20 +15 +29 3.8 2140 19.7 -15 -21 +15 +29 3.8 2400 19.2 -15 -22 +15 +29 3.9 3500 17.4 -16 -35 +14.5 5800 14.3 -19 -16 +11
1. Test conditions: T = 25 C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24 , Icc = 45 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of -1 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency 22 20
S11, S22 (dB)
S11, S22 vs. Frequency 0 -5 -10 -15 -20 -25 -30 -35 -40 3000 0 1 2 3 4 Frequency (GHz) 5 6 S22 S11 Icc (mA) 120 100 80 60 +25C 40 20 0 0.0
Vde vs. Icc
Gain (dB)
18 16 14 +25C 12 500 1000 -40C +85C 2500
1500 2000 Frequency (MHz)
1.0
2.0 3.0 Vde (V)
4.0
5.0
OIP3 vs. Frequency
32
Noise Figure vs. Frequency 4.5 4 3.5 3 2.5 P1dB (dBm) NF (dB) 20 18 16 14 12
P1dB vs. Frequency
30
OIP3 (dBm)
28
26 +25C 24 500 1000 1500 -40C 2000 +85C 2500 3000
+25C 2 500 1000 1500 Frequency (MHz) 2000 10 500 1000
-40C
+85C 2500 3000
Frequency (MHz)
1500 2000 Frequency (MHz)
Typical Device S-Parameters
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-33.66 -25.70 -22.88 -20.95 -21.62 -22.23 -21.00 -20.58 -22.29 -24.96 -38.73 -27.75 -22.85
160.38 57.47 73.66 88.39 77.79 25.60 16.65 10.75 4.19 19.24 11.58 -158.73 -167.85
22.12 21.92 21.40 20.67 19.85 19.15 18.29 17.55 16.72 15.98 15.29 14.67 14.12
177.97 160.79 142.72 126.57 111.46 99.29 86.85 74.67 62.69 51.73 41.78 32.60 23.12
-23.51 -23.66 -23.41 -23.49 -23.03 -23.10 -22.58 -22.06 -21.59 -20.86 -20.66 -19.86 -19.66
-0.74 0.45 0.69 1.82 2.10 1.10 2.16 0.98 -1.56 -5.93 -8.63 -10.67 -12.11
-42.92 -25.55 -22.04 -16.66 -14.30 -15.12 -13.92 -12.97 -11.90 -10.64 -9.87 -10.03 -10.68
-10.61 -59.74 -132.34 -164.52 -178.04 -177.70 170.72 153.21 137.74 126.68 121.15 119.72 122.34
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 2 of 4 April 2006
SCG002
Vcc Icc = 45 mA
The Communications Edge TM Product Information
InGaP HBT Gain Block
Recommended Application Circuit SCG002B-PCB
R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN SCG002B C1 Blocking Capacitor C2 Blocking Capacitor RF OUT
Reference Designator L1 C1, C2, C4
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
2500 18 nH 56 pF
3500 15 nH 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. L1 C1, C2 C3 C4 R4
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 24 1% tolerance
Size 0603 0603 0603 0805
Recommended Bias Resistor Values Supply R1 value Size Voltage 5V 24.4 ohms 0805 6V 46.7 ohms 0805 8V 91 ohms 1210 9V 113 ohms 1210 10 V 136 ohms 2010 12 V 180 ohms 2010
The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +5 V. A 1% tolerance resistor is recommended.
Specifications and information are subject to change without notice
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 3 of 4 April 2006
SCG002
The Communications Edge TM Product Information
InGaP HBT Gain Block
SCG002B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an "S002G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an "S002" designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating
Land Pattern
ESD Rating: Value: Test: Standard:
Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 4 of 4 April 2006

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